CSP

  • 释义
  • Cast Steel Plate 铸钢板;

  • 双语例句
  • 1、

    CSP layer provides briefness and wieldy function library for trader doing encrypt integration.

    CSP层,即抽象设备层,其为加密服务集成商提供的简单、易用接口函数库.

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  • 2、

    CSP is the most generally cryptographic interface of PKI.

    CSP是目前应用最广泛的PKI密码 接口.

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  • 3、

    Formation of cold bending crack of EAF - CSP hot rolled strip was studied.

    分析了珠钢 EAF—CSP 工艺生产的热轧带钢冷弯裂纹的形成原因.

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  • 4、

    CSP 2 also contained uronuc acid indicated by Discher method. I.

    Discher法测试表明CSP—2含有糖醛酸.

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  • 5、

    The V - N microalloy steel with yield strength of 550 MPa is produced by EAF - CSP route.

    目前,在EAF-CSP 流程中通过V -N 微合金化技术可成功生产屈服强度为550MPa的高强度低合金钢.

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  • 6、

    Superiority and difficulties of developing checkered plates in the CSP process are introduced.

    介绍了采用CSP工艺技术轧制花纹板的优势及技术难点.

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  • 7、

    Zhujiang steel CSP plant's descaling technology is an advantage position in China metallurgy industry.

    珠钢CSP生产线的除鳞技术在全国同行业中处于领先地位.

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  • 8、

    And when all the proper testing, you can go with a formal signature of the CSP.

    而当测试一切妥当后, 就可以拿着正式的CSP去签名了.

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  • 9、

    The CSP rolling line of MA Steel is one of the most advanced thin rolling lines.

    马钢CSP生产线是当今技术最先进、装备水平最高的薄板坯连轧生产线之一.

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  • 10、

    The present state of CSP products and its properties at Liangang were introduced.

    介绍了涟钢CSP产品的现状及其性能.

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  • 11、

    Combining the status of the CSP circulation cooling water system of Maanshan Iron & Steel Co.

    结合马钢 CSP 循环冷却水系统,阐述了以不同物质浓度检测循环冷却水浓缩倍数的可行性、实用性.

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  • 12、

    The main clinical manifestation of CSP included headache, dizziness and epilepsy.

    其主要临床症状包括头痛 、 眩晕和癫痫等.

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  • 13、

    Celiprolol enantiomer was resolved directly by using phase HPLC with urea derivative chiral stationary phase ( CSP ).

    用脲衍生物型手性固定相直接拆分了药物对映体噻利洛尔.

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  • 14、

    CSP was divided into four types by CT according to the site, size and shape.

    根据透明隔腔的部位 、 大小及形态,将其分为四种类型.

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  • 15、

    Assembly of Advanced packages such as Ball Grid Array ( BGA ) and Chip Size Package ( CSP ).

    先进封装的装配,如球形焊点阵列和芯片尺寸封装.

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